Product Overview
STAYSTIK 892 thermoplastic adhesive film is designed for use in a variety of electronic applications, and is characterized by excellent bonding at low process temperatures. Its properties make it exceptional for heat sink and substrate bonding as well as TAB bonding to PCB. The unique reworkability of this thermoplastic adhesive system offers many advantages in applications traditionally ill-suited to thermoset adhesives.
Features
- Fast bonding to a variety of substrates
- Easily reworkable material
Technical Data Sheet
STAYSTIK 892 Adhesive Technical Data Sheet English
STAYSTIK 892
Product Name |
Adhesive Type |
Adhesive Format |
Adhesive Technology |
Adhesive Application |
Deposition Method |
Silver |
---|---|---|---|---|---|---|
STAYSTIK 892 |
Non-conductive |
Film Preforms |
Thermally Conductive |
Structural Bonding |
Lamination |
Aluminum Oxide |