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Product Overview
STAYSTIK 336T thermoplastic adhesive paste is a low modulus polymer specially developed for temporary bonding applications most typically associated with GaAs and silicon wafer thinning.
It can also be used for a variety of applications were temporary adhesion is necessary. This adhesive can be easily debonded in Isopropyl Alcohol (I.P.A.) leaving no residue or contamination on the surface of the debonded assembly.
Features
- Fast bonding to a variety of substrates
- Easily reworkable material
Technical Data Sheet
STAYSTIK 336T Adhesive Technical Data Sheet English
STAYSTIK 336T
|
Product Name |
Adhesive Type |
Adhesive Format |
Adhesive Technology |
Adhesive Application |
Deposition Method |
Silver |
|---|---|---|---|---|---|---|
|
STAYSTIK 336T |
Non-conductive |
Paste |
Insulating |
Structural Bonding |
Dispensing |
None |
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