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Conductive die attach products
ATROX conductive die attach products offer a complete solution with lower total cost of ownership ushering in a new era of high performance materials.
Features
- High thermal conductivity > 200 W/m-K
- High power semiconductor packages.
- Low resin bleed out.
- Low condensable organics.
Electrically and Thermally Conductive Die Attach Adhesive
ATROX 850HT1 is a thermosetting conductive die attach adhesive with extremely high thermal conductivity designed for high power semiconductor packages. ATROX 850HT1 has low resin bleed out and low condensable organics which ensure excellent package reliability.
ATROX 850HT1
|
Product Name |
Die Attach Format |
DA Funcitional Property |
Die Attach Technology |
|---|---|---|---|
|
ATROX 850HT1 |
Paste |
Conductive |
Polymer |
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