Product Overview

ATROX NC300-1 is a thermally conductive and electrically insulating die attach adhesive paste. ATROX NC300-1 is formulated to be applied via time pressure dispensing, with either single needle or showerhead configuration. It has a high glass transition temperature and a low temperature cure for excellent Moisture Sensitivity Level (MSL) performance on metal and substrate based semiconductor packages.

  • Electrically insulating High Reliability die attach
  • Moderate stress for all die sizes
  • Robust adhesion on metal and non-metal surfaces: Ag, Cu, PPF, Au, Si, substrate, etc.
  • Excellent ㅇispensability for high throughput
Technical Data Sheet
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ATROX NC300-1 Die-Attach Paste TDS English

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Key Requirements For Attaching Die

  • Thermally conductive. Electrically insulating die attach
  • Superior Reliability
  • Low outgassing
  • Excellent moisture resistance
ATROX NC200-3

Key Requirements For Attaching Die

  • Thermally conductive. Electrically insulating die attach
  • Superior Reliability
  • Low outgassing
  • Excellent moisture resistance
ATROX NC200-3

ATROX die attach paste and ATROX die attach film products

ATROX die attach paste and ATROX die attach film products offer excellent reliability and high throughput for various packages.

Leadframe Packaging Laminate Packaging Power Semiconductor Power Discrete

ATROX die attach paste and ATROX die attach film products

ATROX die attach paste and ATROX die attach film products offer excellent reliability and high throughput for various packages.

Leadframe Packaging Laminate Packaging Power Semiconductor Power Discrete

ATROX, ALPHA Argomax, ALPHA TrueHeight Preforms, Die/Clip attach solutions provide high reliability solutions for demanding power packaging needs.

Various technologies for die and clip attach are provided for unique solutions which address high thermal and demanding reliability applications.

Die Attach

ATROX, ALPHA Argomax, ALPHA TrueHeight Preforms, Die/Clip attach solutions provide high reliability solutions for demanding power packaging needs.

Various technologies for die and clip attach are provided for unique solutions which address high thermal and demanding reliability applications.

Die Attach

Key Requirements For Attaching Die

  • Thermally conductive. Electrically insulating die attach
  • Superior Reliability
  • Low outgassing
  • Excellent moisture resistance
ATROX NC200-3

Key Requirements For Attaching Die

  • Thermally conductive. Electrically insulating die attach
  • Superior Reliability
  • Low outgassing
  • Excellent moisture resistance
ATROX NC200-3

ATROX die attach paste and ATROX die attach film products

ATROX die attach paste and ATROX die attach film products offer excellent reliability and high throughput for various packages.

Leadframe Packaging Laminate Packaging Power Semiconductor Power Discrete

ATROX die attach paste and ATROX die attach film products

ATROX die attach paste and ATROX die attach film products offer excellent reliability and high throughput for various packages.

Leadframe Packaging Laminate Packaging Power Semiconductor Power Discrete

ATROX, ALPHA Argomax, ALPHA TrueHeight Preforms, Die/Clip attach solutions provide high reliability solutions for demanding power packaging needs.

Various technologies for die and clip attach are provided for unique solutions which address high thermal and demanding reliability applications.

Die Attach

ATROX, ALPHA Argomax, ALPHA TrueHeight Preforms, Die/Clip attach solutions provide high reliability solutions for demanding power packaging needs.

Various technologies for die and clip attach are provided for unique solutions which address high thermal and demanding reliability applications.

Die Attach
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