Conductive Die Attach Products
ATROX conductive die attach products offer a complete solution with lower total cost of ownership ushering in a new era of high performance materials.
Features
- High thermal printable hybrid silver sintered die attach.
- High power semiconductor packages.
- Low resin bleed out.
- Low condensable organics.
Technical Data Sheet
![TDS-icon](/sites/default/files/2021-08/Documentation%20icon%20-%20TDS.jpg)
ATROX 800HT2V-P1 Die Attach TDS English
![ATROX-DIE-ATTACH](/sites/default/files/2021-07/SS-dieattach-category1.jpg)
ATROX 800HT2V-P1
ATROX 800HT2V-P1 is a thermosetting conductive printable die attach adhesive with very high thermal conductivity designed for high power semiconductor packages. ATROX 800HT2V-P1 has low resin bleed out and low condensable organics which ensure excellent package reliability.
ATROX 800HT2V-P1
Product Name |
Die Attach Format |
DA Funcitional Property |
Die Attach Technology |
---|---|---|---|
ATROX 800HT2V-P1 |
Paste |
Conductive |
Polymer |