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Conductive Die Attach Products
ATROX conductive die attach products offer a complete solution with lower total cost of ownership ushering in a new era of high performance materials.
Features
- Good thermal conductivity > 20 W/m-K
- Low stress material for small to medium size die packages (< 25mm2).
- Low RBO and compatible with multiple leadframe surfaces: Cu & PPF (NiPdAu).
Technical Data Sheet
ATROX HT900-3 Die Attach TDS English
Electrically and Thermally Conductive Die Attach Adhesive
ATROX HT900-3 is a thermosetting conductive die attach adhesive with high thermal conductivity designed for high brightness LED die attach which require optimum lumen output and superior heat dissipation properties.
ATROX HT900-3 has low resin bleed out and low condensable organics which ensure excellent package reliability especially on oxidized surfaces.
ATROX HT900-3
|
Product Name |
Die Attach Format |
DA Functional Property |
Die Attach Technology |
|---|---|---|---|
|
ATROX HT900-3 |
Paste |
Conductive |
Polymer |
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