Conductive Die Attach Products
ATROX conductive die attach products offer a complete solution with lower total cost of ownership ushering in a new era of high performance materials.
Features
- Good thermal conductivity > 5 W/m-K
- Can be cured by thermal processing in standard IR, full convection, conduction or vapor phase oven equipment.
- Compatible with either nitrogen or air cure conditions.
Technical Data Sheet
ATROX HT900-1 Die Attach TDS English
Electrically and Thermally Conductive Die Attach Adhesive
ATROX HT900-1 is a thermosetting conductive die attach adhesive designed for LED packages. The unique chemistry of ATROX HT900-1 allows the material to be cured at lower temperatures compared to standard die attach adhesives, while maintaining its material properties.
ATROX HT900-1 has low resin bleed out and low condensable organics which ensure excellent package reliability.
ATROX HT900-1
Product Name |
Die Attach Format |
DA Functional Property |
Die Attach Technology |
---|---|---|---|
ATROX HT900-1 |
Paste |
Conductive |
Polymer |