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Product Overview
The MICROFAB DVF-200 is an acid copper plating process that fills Through-Silicon Vias (TSVs) without voids and other defects at high plating speeds. The process is specially formulated for vias with diameters that range from 5 to 100 μm, and with aspect ratios less than 10.1.
Features
- Excellent bottom up fill
- Versatility
- Ease-of-use
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MICROFAB-DVF-200-EN-TDS
10x100um TSV
MICROFAB DVF-200
|
Product Name |
Cu Packaging Solution |
Cu Process Feature |
Feature-Property Benefit |
|---|---|---|---|
|
MICROFAB DVF-200 |
TSV |
Excellent Bottom Up Fill |
Ease-of-Use |
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