Product Overview
The MICROFAB DVF-200 is an acid copper plating process that fills Through-Silicon Vias (TSVs) without voids and other defects at high plating speeds. The process is specially formulated for vias with diameters that range from 5 to 100 μm, and with aspect ratios less than 10.1.
Features
- Excellent bottom up fill
- Versatility
- Ease-of-use
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![TDS-icon](/sites/default/files/2021-08/Documentation%20icon%20-%20TDS.jpg)
MICROFAB-DVF-200-EN-TDS
10x100um TSV
![MICROFAB-DVF200](/sites/default/files/inline-images/SS_Copper_DVF1.jpg)
MICROFAB DVF-200
Product Name |
Cu Packaging Solution |
Cu Process Feature |
Feature-Property Benefit |
---|---|---|---|
MICROFAB DVF-200 |
TSV |
Excellent Bottom Up Fill |
Ease-of-Use |