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MICROFAB RDLV 50, 60, 70
The MICROFAB RDLV 50, 60, 70 processes are an acid copper plating system designed for simultaneous plating of RDL lines and filling of vias across a wide range of line, space and via dimensions. These products have been designed to attain bottom-up via filling while maintaining a flat line profile with excellent uniformity.
Features
- 2 in 1 RDL
- Excellent bottom up fill
- Excellent coplanarity
- Versatility
- Low voiding
- Flat bump shape
- Low-line doming
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MICROFAB® RDLV 60 Series Technical Data Sheet English
Excellent Bottom-Up-Fill for High Aspect Ratio Vias
MICROFAB RDLV-50
MICROFAB RDLV-60
MICROFAB RDLV-60 is highly versatile and used for a wide range of feature sizes. Available for use on 2-in-1 and All-in-One features where low line doming is a must.
MICROFAB RDLV-70
MICROFAB RDLV Series
|
Product Name |
Cu Packaging Solution |
Cu Process Feature |
Feature-Property Benefit |
|---|---|---|---|
|
MICROFAB RDLV 50 |
RDL |
2-in-1 RDL |
KV Low |
|
MICROFAB RDLV 60 |
RDL |
2-in-1 RDL Excellent Bottom Up Fill Good Coplanarity All-in-One Versatility |
KV Low Low-Line Doming |
|
MICROFAB RDLV 70 |
RDL |
2-in-1 RDL |
KV Low |
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