Product Overview

The MICROFAB GSW-200 copper process is a unique acid copper plating system designed for filling blind vias across a variety of geometries. The process produces a bright, fine grained, ductile deposit with excellent physical properties. The process enables complete via filling while minimizing surface deposition, reducing cycle time and eliminating the need for planarization.

This MICROFAB GSW-200 Copper Process enables the use of stacked via constructions as well as increasing reliability for via-in-pad designs.

Features

  • Excellent bottom up fill
  • Flat bump shape

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Plating Copper-Macdermid Alpha

Superior Bottom Up Fill and Flat Pad

MICROFAB GSW-200 was developed to fill conformal vias with large pads. This solution excels at stepped via’s and is void free, seam free fast filling.

MICROFAB GSW-200

Product Name

Cu Packaging Solution

Cu Process Feature

Feature-Property Benefit

MICROFAB GSW-200

Viafill

Excellent Bottom Up Fill

Flat Bump Shape

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