Product Overview
The MICROFAB GSW-200 copper process is a unique acid copper plating system designed for filling blind vias across a variety of geometries. The process produces a bright, fine grained, ductile deposit with excellent physical properties. The process enables complete via filling while minimizing surface deposition, reducing cycle time and eliminating the need for planarization.
This MICROFAB GSW-200 Copper Process enables the use of stacked via constructions as well as increasing reliability for via-in-pad designs.
Features
- Excellent bottom up fill
- Flat bump shape
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Superior Bottom Up Fill and Flat Pad
MICROFAB GSW-200 was developed to fill conformal vias with large pads. This solution excels at stepped via’s and is void free, seam free fast filling.
MICROFAB GSW-200
Product Name |
Cu Packaging Solution |
Cu Process Feature |
Feature-Property Benefit |
---|---|---|---|
MICROFAB GSW-200 |
Viafill |
Excellent Bottom Up Fill |
Flat Bump Shape |