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Product Overview
ALPHA NCX-402-M3 is a highly active, halogen-free, ultra low residue no clean flux, engineered for flip chip attach applications.
ALPHA NCX-402-M3 is designed to achieve high yields with excellent SIR reliability performance to ensure the final packaging will meet electrical reliability needs. Residue level post reflow is exceptionally low to ensure maximum compatibility with capillary and molded underfill material.
Features
- Good thermal stability, tack strength and high activity for excellent yield rates
- Ultra low residue post reflow; <10% by Wt
- IPC-J-STD-004 compliant for long term electrical reliability
- Halide and halogen-free formulation
Halogen Free, Ultra Low Residue No-Clean Flux for Flip Chip Attach, And Pop Stacking Applications
Technical Data Sheets
ALPHA WS-608 Technical Data Sheet English
ALPHA NCX-402-M3
|
Product Name |
Flux Type |
Flux Process |
Component Type |
|---|---|---|---|
|
ALPHA NCX-402-M3 |
No Clean |
Ball Attach |
FC-QFN |
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