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Product Overview
Kester TSF-ULR18 is a no clean ultra low residue tacky flux. TSF-ULR18 is highly recommended for Flip Chip on leadframe (FCOL, FCQFN, etc) packages, where flux cleaning is not required.
TSF-ULR18 produces post reflow residue of below 10% wt, that is highly reliable and is compatible with post process materials.
Features
- Ultra low residue post reflow; <10% by Wt
- Excellent for Flip Chip on leadframe package
- Halide and halogen-free formulation
Technical Data Sheets
TSF-ULR18 Technical Data Sheet English
Kester TSF-ULR18
|
Product Name |
Flux Type |
Flux Process |
Component Type |
|---|---|---|---|
|
TSF-ULR18 |
No Clean |
Ball Attach |
FC-QFN |
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