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Product Overview
ALPHA WS9160-M7 water soluble flux is engineered to be used in the attachment of Sn-Pb Eutectic or Pb-free spheres onto BGA, CSP or wafer level components. It is compatible with Cu-UBM, Cu-OSP, electrolytic Ni-Au and ENIG pad finishes.
Features
- Excellent activity allows for excellent soldering to Cu UBM, Cu OSP and ENIG soldering process
- Excellent wettability: Excellent activity reduces the occurrence of dark balls
- Excellent cleanability: Flux residues are removed easily with warm DI water
- High tackiness allows high yields for wafer level ball attach
Water Soluble Flux
Technical Data Sheets
ALPHA WS9160-M7 Technical Data Sheet English
ALPHA WS9160-M7
| Product Name | Flux Type | Flux Process | Component Type |
|---|---|---|---|
| ALPHA WS9160-M7 | Water Soluble | Ball Attach Flip Chip Attach | BGA / CSP WLP |
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