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Product Overview
ALPHA WS9180-MHV water soluble halide-free flux is engineered to be used in the attachment of lead-free or tin-lead eutectic spheres onto BGA or CSP components as well as ball drop on wafer WLCSP applications. It is highly compatible with Cu-OSP, electrolytic Ni-Au and ENEPIG pad finishes with best-in-class fluxing activity resulting in maximized yield.
Features
- Excellent activity allows for excellent soldering to Cu, Cu OSP and ENIG soldering process
- Excellent material stability – maintains viscosity tack and viscosity over time
- Wide process window for maximum application flexibility especially for wafer level ball attach
- Excellent print and pin-transfer stability
Water Soluble Flux for Semiconductor Ball-Attach
Technical Data Sheets
ALPHA WS9180-MHV Technical Data Sheet English
ALPHA WS9180-MHV
| Product Name | Flux Type | Flux Process | Component Type |
|---|---|---|---|
| ALPHA WS9180-MHV | Water Soluble | Ball Attach Flip Chip Attach | BGA / CSP WLP |
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