Product Overview

ALPHA WS9160-M7 water soluble flux is engineered to be used in the attachment of Sn-Pb Eutectic or Pb-free spheres onto BGA, CSP or wafer level components. It is compatible with Cu-UBM, Cu-OSP, electrolytic Ni-Au and ENIG pad finishes.

Features

  • Excellent activity allows for excellent soldering to Cu UBM, Cu OSP and ENIG soldering process
  • Excellent wettability: Excellent activity reduces the occurrence of dark balls
  • Excellent cleanability: Flux residues are removed easily with warm DI water
  • High tackiness allows high yields for wafer level ball attach

Water Soluble Flux

Technical Data Sheets
TDS-icon

ALPHA WS9160-M7 Technical Data Sheet English

ALPHA WS9160-M7

Product NameFlux TypeFlux ProcessComponent Type
ALPHA WS9160-M7Water SolubleBall Attach
Flip Chip Attach
BGA / CSP
WLP
What do you need solved?
Let our experts find your solution.