Product Overview

KESTER TSF-6522RH is a no clean rosin-based paste flux, designed to meet IPC halogen-free requirements. TSF-6522RH is formulated for customers familiar with Kester's leading TSF-6522 flux, but now must comply to halogen-free requirements.

Features

  • High tack values and long tack life
  • ROL0 IPC classification
  • Excellent for Flip chip on lead and flexible circuits application

No-Clean Tacky Soldering Flux

Technical Data Sheets
TDS-icon

TSF-6522RH Technical Data Sheet English

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Product Flyer
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TSF-6522RH Product Flyer English

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Kester TSF-6522RH

Product Name

Flux Type

Flux Process

Component Type

TSF-6522RH

No Clean

Ball Attach
Flip Chip Attach

BGA / CSP
FC
FC-QFN

High Activity No-Clean Flux

  • Excellent reflow yields
  • High reliability solder joints
NCX-390 Kester TSF6592HF

High Activity No-Clean Flux

  • Excellent reflow yields
  • High reliability solder joints
NCX-390 Kester TSF6592HF

High Reliability No-Clean Soldering Solutions

Please see Solutions page for details.

Sphere Attach Flip Chip attach

High Reliability No-Clean Soldering Solutions

Please see Solutions page for details.

Sphere Attach Flip Chip attach

High Activity No-Clean Flux

  • Excellent reflow yields
  • High reliability solder joints
NCX-390 Kester TSF6592HF

High Activity No-Clean Flux

  • Excellent reflow yields
  • High reliability solder joints
NCX-390 Kester TSF6592HF

High Reliability No-Clean Soldering Solutions

Please see Solutions page for details.

Sphere Attach Flip Chip attach

High Reliability No-Clean Soldering Solutions

Please see Solutions page for details.

Sphere Attach Flip Chip attach
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