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Product Overview
Kester TSF-6592HF is a no clean paste flux designed as a lead-free solution for an array of lead free interconnect applications such as flip chip attach, sphere or ball attach, rework/repair of CSPs, BGAs, SMDs, or any lead-free soldering application that requires a very tacky flux. It is optimized for consistent high speed printing applications.
Features
- Bright shiny solder joints with clear residues
- Aggressive flux on various substrates such as OSP-Cu, immersion finishes and ENIG
- Clear non-tacky residues
- High tack to minimize skewing of components
Kester TSF-6592HF
|
Product Name |
Flux Type |
Flux Process |
Component Type |
|---|---|---|---|
|
TSF-6592HF |
No Clean |
Ball Attach |
BGA / CSP |
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