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Product Overview
ALPHA NCP-1213 is a high lead, zero-halogen no clean solder paste designed for high power, high performance, die attach applications.
This product is available as a dispensing and printing solder paste. Its excellent dispensing repeatability provides value by reducing defects associated with dispense process variability. Additionally, the low voiding performance is ideally suited to minimize voiding under the die, after reflow, for demanding high power die attach applications.
Features
- Excellent voiding performance on die attach applications
- Excellent dispensing consistency
- High reliability die attach connection for high power semiconductor applications
ALPHA NCP-1213 is a high lead, zero-halogen, no-clean solder paste designed for high power, high performance, die attach applications.
ALPHA NCP-1213 Solder Paste TDS English
ALPHA NCP-1213
|
Product Name |
Paste Type |
Alloy Type |
Feature Capability |
Paste Component Type |
|---|---|---|---|---|
|
ALPHA NCP-1213 |
No Clean |
Lead-Free |
Dispensing |
Leadframe-Die Attach |
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