Leading Cored Wires for Robotic Soldering

PRODUCT NAME DESCRIPTION KEY FEATURES
ALPHA Telecore HF-850 Cored Wire  A cored wire suitable for use in any electronic or industrial no-clean soldering application that specifies compliance to the IPC J-STD-004 ROL0 standard. It is ideal for electronic assemblies used in Automotive, Consumer Electronics, Computer and Peripherals, Mobile Devices and White Goods.
  • Very fast wetting
  • Very low flux spatter, safer for operator use
  • Good spread characteristics 
ALPHA Telecore XL-825 Cored Wire A cored wire suitable for use in any commercial no-clean hand soldering application that specifies compliance to JIS grade AA standard.  It offers the balance of high SIR reliability and excellent spread characteristics.
  • Very fast wetting: Excellent for drag soldering
  • Very low flux spatter: Safe to use
  • Good spread characteristics: Excellent first pass solder joints
Kester 268 Cored Wire A zero-halogen wire optimized for robotic soldering applications, it provides consistent workability performance for both robotic and manual soldering in the electronics industry, with performance equivalent to conventional halogen/ halide-based systems.
  • Low occurrence of solder ball spatter, smoke and odor
  • Conforms to halogen-free requirement with no intentionally added halogens and halides
  • Excellent wetting speed and spread

 

Through hole components are generally heavier, carry more current or subject to greater mechanical strain (i.e. connectors) and subsequently require more solder volume. Our products are designed to meet the challenges of through hole soldering. 

Solder Paste Solder Preforms Cored Solder Wire Soldering Alloys HiTech Adhesives & Encapsulants

Through hole components are generally heavier, carry more current or subject to greater mechanical strain (i.e. connectors) and subsequently require more solder volume. Our products are designed to meet the challenges of through hole soldering. 

Solder Paste Solder Preforms Cored Solder Wire Soldering Alloys HiTech Adhesives & Encapsulants

Through hole components are generally heavier, carry more current or subject to greater mechanical strain (i.e. connectors) and subsequently require more solder volume. Our products are designed to meet the challenges of through hole soldering. 

Wave Soldering Selective Soldering Selectively Increasing Solder Volume Gluing, Underfilling & Edgebonding

Through hole components are generally heavier, carry more current or subject to greater mechanical strain (i.e. connectors) and subsequently require more solder volume. Our products are designed to meet the challenges of through hole soldering. 

Wave Soldering Selective Soldering Selectively Increasing Solder Volume Gluing, Underfilling & Edgebonding

Through hole components are generally heavier, carry more current or subject to greater mechanical strain (i.e. connectors) and subsequently require more solder volume. Our products are designed to meet the challenges of through hole soldering. 

Fine Feature Enabling Cored Wire Cost effective, high performance Cored Wire High Reliability Cored Solder Wires Regulatory Compliance & Corporate Sustainability

Through hole components are generally heavier, carry more current or subject to greater mechanical strain (i.e. connectors) and subsequently require more solder volume. Our products are designed to meet the challenges of through hole soldering. 

Fine Feature Enabling Cored Wire Cost effective, high performance Cored Wire High Reliability Cored Solder Wires Regulatory Compliance & Corporate Sustainability

Through hole components are generally heavier, carry more current or subject to greater mechanical strain (i.e. connectors) and subsequently require more solder volume. Our products are designed to meet the challenges of through hole soldering. 

Solder Paste Solder Preforms Cored Solder Wire Soldering Alloys HiTech Adhesives & Encapsulants

Through hole components are generally heavier, carry more current or subject to greater mechanical strain (i.e. connectors) and subsequently require more solder volume. Our products are designed to meet the challenges of through hole soldering. 

Solder Paste Solder Preforms Cored Solder Wire Soldering Alloys HiTech Adhesives & Encapsulants

Through hole components are generally heavier, carry more current or subject to greater mechanical strain (i.e. connectors) and subsequently require more solder volume. Our products are designed to meet the challenges of through hole soldering. 

Wave Soldering Selective Soldering Selectively Increasing Solder Volume Gluing, Underfilling & Edgebonding

Through hole components are generally heavier, carry more current or subject to greater mechanical strain (i.e. connectors) and subsequently require more solder volume. Our products are designed to meet the challenges of through hole soldering. 

Wave Soldering Selective Soldering Selectively Increasing Solder Volume Gluing, Underfilling & Edgebonding

Through hole components are generally heavier, carry more current or subject to greater mechanical strain (i.e. connectors) and subsequently require more solder volume. Our products are designed to meet the challenges of through hole soldering. 

Fine Feature Enabling Cored Wire Cost effective, high performance Cored Wire High Reliability Cored Solder Wires Regulatory Compliance & Corporate Sustainability

Through hole components are generally heavier, carry more current or subject to greater mechanical strain (i.e. connectors) and subsequently require more solder volume. Our products are designed to meet the challenges of through hole soldering. 

Fine Feature Enabling Cored Wire Cost effective, high performance Cored Wire High Reliability Cored Solder Wires Regulatory Compliance & Corporate Sustainability
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