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Selectively Increasing Solder Volume
During assembly, some components benefit from the addition of small amounts of solder to enhance joint strength, reduce voiding and / or address non-wet opens related to component warpage. We offer customized, pre-fluxed or unfluxed solder preform solutions that can be seamlessly implemented into current SMT processes.
Leading Solder Preforms for Selectively Increasing Solder Volume
- Repeatable solder volume precision
- Minimize Flux residue
- Low voiding
- Thermal management
- Highly customizable configuration
| PRODUCT | DESCRIPTION | KEY FEATURES |
|---|---|---|
| ALPHA Exactalloy Tape & Reel Preforms | Offering increased solder volume for joint reliability, reduced flux residue for improved electrical reliability, and void reduction under component thermal pads. |
|
Through hole components are generally heavier, carry more current or subject to greater mechanical strain (i.e. connectors) and subsequently require more solder volume. Our products are designed to meet the challenges of through hole soldering.
Through hole components are generally heavier, carry more current or subject to greater mechanical strain (i.e. connectors) and subsequently require more solder volume. Our products are designed to meet the challenges of through hole soldering.
Through hole components are generally heavier, carry more current or subject to greater mechanical strain (i.e. connectors) and subsequently require more solder volume. Our products are designed to meet the challenges of through hole soldering.
Through hole components are generally heavier, carry more current or subject to greater mechanical strain (i.e. connectors) and subsequently require more solder volume. Our products are designed to meet the challenges of through hole soldering.
Through hole components are generally heavier, carry more current or subject to greater mechanical strain (i.e. connectors) and subsequently require more solder volume. Our products are designed to meet the challenges of through hole soldering.
Through hole components are generally heavier, carry more current or subject to greater mechanical strain (i.e. connectors) and subsequently require more solder volume. Our products are designed to meet the challenges of through hole soldering.
Through hole components are generally heavier, carry more current or subject to greater mechanical strain (i.e. connectors) and subsequently require more solder volume. Our products are designed to meet the challenges of through hole soldering.
Through hole components are generally heavier, carry more current or subject to greater mechanical strain (i.e. connectors) and subsequently require more solder volume. Our products are designed to meet the challenges of through hole soldering.
Through hole components are generally heavier, carry more current or subject to greater mechanical strain (i.e. connectors) and subsequently require more solder volume. Our products are designed to meet the challenges of through hole soldering.
Through hole components are generally heavier, carry more current or subject to greater mechanical strain (i.e. connectors) and subsequently require more solder volume. Our products are designed to meet the challenges of through hole soldering.
Through hole components are generally heavier, carry more current or subject to greater mechanical strain (i.e. connectors) and subsequently require more solder volume. Our products are designed to meet the challenges of through hole soldering.
Through hole components are generally heavier, carry more current or subject to greater mechanical strain (i.e. connectors) and subsequently require more solder volume. Our products are designed to meet the challenges of through hole soldering.
Let our experts find your solution.