Flyers

A one component, heat curable material.

One component, intermediate temperature, fast heat curable materials which are designed to mechanically protect assembled chips and encapsulated IC devices from dropping off or cracking.

Epoxy based materials to be dispensed on the edges of the BGA, CSP or Flip Chip devices.

• 粘合剂
• 底部填充剂
• 边缘粘结剂
• 密封剂

一种单组分、中温、快速可热固化的材料，旨在为组装的芯片和封装的IC器件提供机械保护，防止脱落或破裂。

基于环氧树脂的材料，用于 BGA、CSP 或倒装芯片器件边缘的涂覆。

应用范围广，涵盖各种元件及工艺条件。

一种单组份、可热固化材料。固化的填充剂有助于提高焊接组装部件的强度，因此可以通过跌落冲击、冲击弯曲和热循环（TCT）等可靠性测试。

Designed to enable low temperature processes in selective and dip soldering.

A new, ultra-low temperature solder paste paired with ALPHA ULT1 alloy intended for soldering temperature sensitive components and substrates.

一种新型超低温焊膏，与ALPHA ULT1合金配合使用，为温度敏感组件和基板进行焊接。

Designed to meet the growing demand for ultra fine feature applications and consistent print volume repeatability.