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A high reliability, low temperature solder paste designed to increase production yield and reduce component warpage.
Una soldadura en pasta de baja temperatura y alta confiabilidad diseñada para aumentar el rendimiento de producción y reducir la deformación de los componentes.
ALPHA OM-565 HRL3 low temperature solder paste is formulated for a broad range of assemblies to mitigate warpage induced defects in temperature sensitive chip-scale packages.
Ensure solder baths are within required specification for successful soldering operations.
Asegúrese que la soldadura de los crisoles estén dentro de las especificaciones requeridas para operaciones exitosas de soldadura.
Maximize your metal recovery return.
A low cost, high performance wave and selective soldering alloy for use on simple to moderately complex, dual sided assemblies.