Technical Bulletins

A thinner specifically formulated to restore Alpha fluxes to peak performance.

A biodegradable formulation for the removal of mineral deposits frequently seen when using “hard” water in aqueous cleaning equipment. Works by dissolving and sequestering calcium, magnesium and iron carbonates and oxide scale.

QPL-approved (Type WSF-0 polyglycol-free flux), halide-free, water soluble flux cored wire. 

ALPHA HF-1 Flux Gel is a rosin-based paste flux designed for rework of surface mount and other demanding electronic assembly applications. Because of its unique activator package and other special additives, ALPHA HF-1 Flux Gel is suitable to remain on the circuit board without cleaning. ALPHA HF-1 Flux Gel’s activator system also enables the flux to penetrate even moderately tarnished surfaces.

A one-component capillary underfill designed to reinforce BGA assembly.  It has a dual unique attribute, able to flow beneath the component at room temperature and protect the assembly from thermo-mechanical and drop shock effects effectively.  

A no-clean paste flux designed for lead-free rework in fine feature printing and reflow applications.

Designed for fine pitch, lead-free applications. It is a no-clean, REL0 formulation offers the SMT process stable viscosity and thixotropy with continuous printing. It also provides resistance to high temperature pre-heating, wettability on ultra-fine pitch pads and reduce the occurrence of solder balling defects.

A Pb-free, zero-halogen no-clean solder paste engineered to enable consistent fine pitch printing capability and designed for applications where ultra-low voiding performance, excellent ICT pin testing first pass yield, and the ability to pass JIS Copper Corrosion test are required.

Lead-free, high silver alloys suitable for use as a replacement for Sb63Pb37.

Solder pastes capable of high reflow performance in vapor phase ovens. The paste chemistries were developed to blend with Type 4 &Type 5 powder making these pastes suitable for fine feature printing applications.