Technical Bulletins

Lint-free pads, impregnated with isopropanol and de-mineralized water blend and packaged in convenient sachets. They are ideal for cleaning all types of connectors before final assembly and for removing contamination and oxidation from connectors during servicing and routine maintenance. 

Is a fast-drying solvent cleaner specially formulated for the quick and efficient removal of flux residues after soldering. Originally designed to replace ozone depleting solvents such as CFC-113 it exhibits enhanced cleaning performance and fast evaporation rates, easily giving MIL-STD cleanliness.

Is a specialist fluorinated polymer coating formulated to provide high levels of liquid repellence to printed circuit boards and other electronic devices.

Is a powerful non-corrosive refrigerant for use as a rapid and safe method of cooling small components, particularly in electrical and electronic equipment. It can also be used for the testing of thermostats and other thermosensitive components and to detect faulty soldered joints and overheating components.

Is a solvent based conformal coating designed to protect printed circuit boards, particularly those exposed to high humidity environments. FSC is widely used in the rail industry and is approved to IEC-61086.

Is a solvent based conformal coating designed to protect printed circuit boards, particularly those exposed to high humidity environments. FSCP offers enhanced adhesion to a variety of substrates, including solder resists with low surface energy.

Is a high purity solvent blend designed for use with our fast drying conformal coatings, AFA and PUCAF.

Is a non-flammable, high powered air duster, designed for the safe removal of dust and airborne contamination from very delicate or inaccessible areas of electrical and electronic equipment.

GF300 is a silicone, thermally conductive material for use at a thermal interface and is specifically developed as a low thermal resistance gap pad.

GF400 is a two-part, liquid silicone based gap filler, which provides excellent thermal performance and can be cured at room temperature or accelerated with heat.

GF500 is a silicone, thermally conductive material for use at a thermal interface and is specifically developed as a low thermal resistance gap pad.

Is a low foaming, highly effective, non-flammable, and non-hazardous cleaner.