Technical Bulletins

Is a flame retardant, thermally conductive, two part potting and encapsulating compound. The flame retardant technology used is of a ‘clean’ type leading to relatively low toxicity fumes and low smoke emission.

Is a slightly thixotropic hot cure one-part epoxy system designed specifically for use as a dipping resin for hybrid circuits and discrete components.  The standard color is blue but other colors are also available for special orders.

Is a two-part, flame retardant epoxy resin with excellent solvent resistance. The rigid and inert nature of this encapsulant makes it ideal for the protection of electrical/electronic units with frequent or complete immersion in such solvents as diesel fuel, leaded and unleaded petrol, water and cellulose thinners.

Is a flame retardant, thermally conductive, two-part potting and encapsulating compound. The flame retardant technology used is of a ‘clean’ type leading to relatively low toxicity fumes and low smoke emission.

Is a UL approved, general purpose, two-part potting and encapsulating compound.  The system utilizes a hardener free of DDM or other aromatic amines.  The flame retardant technology used is of a ‘clean’ type leading to relatively low toxicity fumes and low smoke emission.

Is a flame retardant, general purpose, two part potting and encapsulating compound. The cured product exhibits a high degree of toughness and adhesion and is particularly suited to applications with stringent temperature cycling or thermal shock requirements.  The flame retardant technology used is of a ‘clean’ type leading to relatively low toxicity fumes and low smoke emission.

Is a low viscosity, flame retardant, two part potting and encapsulating compound. The product has been specifically designed for compatibility with reflow applications, therefore remaining stable for short term, high temperature excursions.

Is a semi-thixotropic, heat cure, one-part epoxy designed specifically for use as a dipping resin for hybrid circuits and discrete components. 

Is a flame retardant, thermally conductive, two-part encapsulation compound based on epoxy technology. Designed to meet increasing demands for efficient thermal dissipation, ER2220 combines ease of processing with an enhanced thermal conductivity when compared to traditional thermally conductive encapsulants. Combined with flame retardancy achieving UL94 V-0 level, ER2220 provides the ultimate in protection and performance for a vast array of applications, including those in the rapidly expanding LED industry.

Is a high temperature resistant, thermally conductive, two-part encapsulation compound based on epoxy technology. Designed to meet increasing demands for efficient thermal dissipation, ER2221 combines ease of processing with an enhanced thermal conductivity when compared to traditional thermally conductive encapsulants. It also offers enhanced performance in high temperature applications as well as those subject to thermal cycling.

Is a two-part, high Tg, low viscosity epoxy encapsulation resin which has primarily been developed for encapsulation of electrical components that require high temperature resistance.

Is a two-part filled, high Tg, thermally conductive epoxy encapsulation resin which has primarily been developed for encapsulation of electrical components that require high temperature resistance.