Camera Modules and Flexible Circuit Board Assembly

Assemblies in this segment are used in smartphones, some wearable electronics and a variety of other non-communications related devices. Camera modules are generally quite small and use components which are sensitive to a variety of mechanical stresses.

Key Requirements for Joining Materials

High mechanical and electrical reliability
Fine feature capable
Minimal residues
High throughput, low defects

Product Type	Product Name	Low Temp	PB Free	Halogen Free
Solder Paste	ALPHA OM-353 SAC305 / SACX Plus 0307 Repeatable printing down to 0.3mm/.012” pitch and 01005 passives Lowest post reflow residues of Alpha’s chemistries Low HIP and NWO Defects Available in low silver SACX Plus alloy(s) for improved value		Image	Image
Solder Paste	ALPHA OM-372 SAC305 Best-in-class electrochemical reliability on fine pitched low standoff packages Ultra-fine feature printing & reflow capability down to 008004 components Minimum post reflow residue provides high reliability performance for fine pitch, high density designs
Solder Paste	ALPHA OM-565 HRL3 Compatibility with HRL3 alloy for enhanced thermomechanical and drop shock reliability over existing low temperature solders HRL3 alloy enables peak reflow temperature of 175 °C to mitigate warpage induced defects Low melt point reflow improves energy efficiency in assembly process Compatibility with contact rework applications	Image	Image	Image
Solder Paste	ALPHA OM-220 ULTS Low peak reflow temperature <150 °C Reduction of warpage of components
Solder Paste	ALPHA WS-820 Water Soluble Repeatable printing down to 0.4mm/.016” pitch		Image
Solder Paste	ALPHA WS-826 8-hour stencil life at ambient and elevated environmental conditions up to 30C/70% RH Highly cleanable with Batch and Inline aqueous systems Wide print and reflow process window
Solder Paste	ALPHA JP-500 SAC305 Jettable to 0.5mm/.020” pitch Excellent deposit consistency with high process capability index across all board designs Reduction in random solderballing levels, increasing first time yield		Image	Image
Solder Paste	ALPHA JP-501 SnBiAg Low HIP and NWO Defects Jettable to 0.5mm/.020” pitch	Image	Image	Image
Solder Preforms	ALPHA TrueHeight Spacer Blocks Designed to deliver consistent bondline thickness (BLT) and minimize die tilt resulting in predictable reliability and performance designed into the device. Provide precise height control up to +0.010mm Assure repeatable results with burr-free technology Easily integrate into standard SMT assembly using standard Tape and Reel Packaging
Solder Preforms	ALPHA Exactalloy Tape and Reel Preforms High solder volume precision and production yields using pick and place Available in many alloys, sizes and shapes	Image	Image	Image
Cored Wire	ALPHA Telecore HF-850 SAC305 / SACX Plus 0307 Performs well with all standard pad finishes Can be used in both robotic and manual soldering processes ROL0		Image	Image
Cored Wire	ALPHA Telecore XL-825 SAC305 / SACX Plus 0307 Best for difficult to solder surfaces Can be used in both robotic and manual soldering processes ROL1		Image
Cored Wire	Kester 268 SAC305/K100LD Optimzed for low spatter robotic soldering Can be used for manual and automated soldering processes Zero halogen ROL0
Cored Wire	Kester 285 SAC305 Highly active for soldering difficult surfaces while retaining ROL0 class Can be used for manual and automated soldering processes ROL0
Bar & Solid Wire Solder	ALPHA HRL3 Low temperature enabling in selective and dip soldering processes Provides efficiencies in energy savings and reduces thermal damage Comparable hole fill performance and solder joint strength vs SAC305 Low Copper erosion vs SAC305
Underfill	ALPHA HiTech CU13-3150 Low temperature cure Fast Flow Reworkable			Image
Adhesives	ALPHA HiTech AD13-9692B Low temperature cure Excellent Adhesion on LCP, Magnet Excellent Drop Impact Performance			Image

Gluing, Underfilling and Edgebonding

Key Requirements for Joining Materials

High mechanical and electrical reliability
Fine feature capable
Minimal residues
High throughput, low defects

Product Type	Product Name	Low Temp	PB Free	Halogen Free
Solder Paste	ALPHA OM-353 SAC305 / SACX Plus 0307 Repeatable printing down to 0.3mm/.012” pitch and 01005 passives Lowest post reflow residues of Alpha’s chemistries Low HIP and NWO Defects Available in low silver SACX Plus alloy(s) for improved value		Image	Image
Solder Paste	ALPHA OM-372 SAC305 Best-in-class electrochemical reliability on fine pitched low standoff packages Ultra-fine feature printing & reflow capability down to 008004 components Minimum post reflow residue provides high reliability performance for fine pitch, high density designs
Solder Paste	ALPHA OM-565 HRL3 Compatibility with HRL3 alloy for enhanced thermomechanical and drop shock reliability over existing low temperature solders HRL3 alloy enables peak reflow temperature of 175 °C to mitigate warpage induced defects Low melt point reflow improves energy efficiency in assembly process Compatibility with contact rework applications	Image	Image	Image
Solder Paste	ALPHA OM-220 ULTS Low peak reflow temperature <150 °C Reduction of warpage of components
Solder Paste	ALPHA WS-820 Water Soluble Repeatable printing down to 0.4mm/.016” pitch		Image
Solder Paste	ALPHA WS-826 8-hour stencil life at ambient and elevated environmental conditions up to 30C/70% RH Highly cleanable with Batch and Inline aqueous systems Wide print and reflow process window
Solder Paste	ALPHA JP-500 SAC305 Jettable to 0.5mm/.020” pitch Excellent deposit consistency with high process capability index across all board designs Reduction in random solderballing levels, increasing first time yield		Image	Image
Solder Paste	ALPHA JP-501 SnBiAg Low HIP and NWO Defects Jettable to 0.5mm/.020” pitch	Image	Image	Image
Solder Preforms	ALPHA TrueHeight Spacer Blocks Designed to deliver consistent bondline thickness (BLT) and minimize die tilt resulting in predictable reliability and performance designed into the device. Provide precise height control up to +0.010mm Assure repeatable results with burr-free technology Easily integrate into standard SMT assembly using standard Tape and Reel Packaging
Solder Preforms	ALPHA Exactalloy Tape and Reel Preforms High solder volume precision and production yields using pick and place Available in many alloys, sizes and shapes	Image	Image	Image
Cored Wire	ALPHA Telecore HF-850 SAC305 / SACX Plus 0307 Performs well with all standard pad finishes Can be used in both robotic and manual soldering processes ROL0		Image	Image
Cored Wire	ALPHA Telecore XL-825 SAC305 / SACX Plus 0307 Best for difficult to solder surfaces Can be used in both robotic and manual soldering processes ROL1		Image
Cored Wire	Kester 268 SAC305/K100LD Optimzed for low spatter robotic soldering Can be used for manual and automated soldering processes Zero halogen ROL0
Cored Wire	Kester 285 SAC305 Highly active for soldering difficult surfaces while retaining ROL0 class Can be used for manual and automated soldering processes ROL0
Bar & Solid Wire Solder	ALPHA HRL3 Low temperature enabling in selective and dip soldering processes Provides efficiencies in energy savings and reduces thermal damage Comparable hole fill performance and solder joint strength vs SAC305 Low Copper erosion vs SAC305
Underfill	ALPHA HiTech CU13-3150 Low temperature cure Fast Flow Reworkable			Image
Adhesives	ALPHA HiTech AD13-9692B Low temperature cure Excellent Adhesion on LCP, Magnet Excellent Drop Impact Performance			Image

Gluing, Underfilling and Edgebonding

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Camera Modules and Flexible Circuit Board Assembly

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