Leading Adhesives, Underfills and Edgebonds

  • Excellent adhesion to FR4
  • Fast flow /penetration underfills
  • Fast curing
  • Reworkable 
  • Produces strong, high reliability connections
PRODUCT NAME DESCRIPTION KEY FEATURES 
ALPHA HiTech CF31-4010 High filler content, heat curable Edgebond designed to be dispensed on the corners (corner bonding) or edges (edge bonding) of BGA devices.
  • A lower cost option to conventional underfilling process with increased productivity and lower material volume required
  • High Tg and low CTE values drastically improve ability to pass more Stringent Thermal Cycling Test  
  • Reworkable
ALPHA HiTech CU31-2030 A capillary underfill designed for the protection of assembled chip packages on printed circuit boards.
  • Low Viscosity
  • Room temperature flow capability
  • High Glass Transition Temperature (Tg)
ALPHA HiTech CU21-3240 Designed for the protection of assembled chip packages onto printed circuit boards. It is a high Tg and low CTE underfill with excellent reliability.
  • Provides full component coverage when dispensed onto the substrate preheated at 70 - 100°C
  • High Tg and Low CTE values drastically improve the ability to pass a more stringent Thermal Cycling Test condition
  • Excellent Thermal Cycling Test performance

 

We provide the right set of materials, as well as, the guidance and field support to help you optimize your assembly process. The result: high throughput, high yield production, high efficiency, and high reliability.

Printing Dispensing / Jetting Manual Soldering and Rework Selectively Increasing Solder Volume - SMT Robotic Soldering

We provide the right set of materials, as well as, the guidance and field support to help you optimize your assembly process. The result: high throughput, high yield production, high efficiency, and high reliability.

Printing Dispensing / Jetting Manual Soldering and Rework Selectively Increasing Solder Volume - SMT Robotic Soldering

As the leading innovator for materials in a wide range of industries, we offer a multitude of solutions to provide customers with latest technologies and materials to meet their goals for reliability, performance, cost efficiency and sustainability.

Reliable in Harsh End-Use Environments Halogen Free & Zero Halogen Products

As the leading innovator for materials in a wide range of industries, we offer a multitude of solutions to provide customers with latest technologies and materials to meet their goals for reliability, performance, cost efficiency and sustainability.

Reliable in Harsh End-Use Environments Halogen Free & Zero Halogen Products

We provide the right set of materials, as well as, the guidance and field support to help you optimize your assembly process. The result: high throughput, high yield production, high efficiency, and high reliability.

Printing Dispensing / Jetting Manual Soldering and Rework Selectively Increasing Solder Volume - SMT Robotic Soldering

We provide the right set of materials, as well as, the guidance and field support to help you optimize your assembly process. The result: high throughput, high yield production, high efficiency, and high reliability.

Printing Dispensing / Jetting Manual Soldering and Rework Selectively Increasing Solder Volume - SMT Robotic Soldering

As the leading innovator for materials in a wide range of industries, we offer a multitude of solutions to provide customers with latest technologies and materials to meet their goals for reliability, performance, cost efficiency and sustainability.

Reliable in Harsh End-Use Environments Halogen Free & Zero Halogen Products

As the leading innovator for materials in a wide range of industries, we offer a multitude of solutions to provide customers with latest technologies and materials to meet their goals for reliability, performance, cost efficiency and sustainability.

Reliable in Harsh End-Use Environments Halogen Free & Zero Halogen Products
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