Search
Product Overview
ALPHA HiTech CF12-4485B end market is in portables such as Graphic Cards, Notebooks, Tablets, as well as assembled boards in Automotive and Medical accessories.
It can be stored in non-freezing condition of 1 - 10°C.
Product Features
- A lower cost option to conventional underfilling process with increased productivity and lower material volume required
- Long Pot Life of 7 days
- Excellent Adhesion on FR4
- Halogen-free and complies with RoHS Directive 2015/863/EU
Non-freezing, low shipment cost Edgebond
Dry Ice shipment is a costly process. For applications not requiring high temperature exposurem ALPHA HiTech CF12-4485B is an effective edgebond for consideration, if so adopted only requires 1 - 10°C storage condition. It has been tested to pass 1500 cycles protecting SAC305 solder joints in BGA assembly subjected to -40 +125°C Thermal Cycling test. Standalone solder joints can only survive 600 cycles under this same condition.
What do you need solved?
Let our experts find your solution.
Let our experts find your solution.