Recommended Products

PRODUCT NAME DESCRIPTION KEY FEATURES
ALPHA HiTech AD43-9600W ALPHA HiTech AD43-9600W is a one-component, low temperature cure epoxy system.  It is specially designed to bond the lens onto a PCB bar for BLU (Back Light Unit) application.
  • Excellent Adhesion on FR4 and PMMA lens
  • White appearance to avoid ‘flaring’ phenomena when LED is lighted up
  • Halogen-free
ALPHA HiTech AD13-9692B ALPHA HiTech AD13-9692B is a one-component, low temperature cure epoxy system.  It is suitable for bonding heat sensitive devices and is specially designed for camera module application.
  • Fast Cure at Low Temperature
  • Excellent Drop Shock for units bonded to LCP
  • Halogen Free
ALPHA HiTech AD13-9521B ALPHA HiTech AD13-9521B is a one-component low temperature cure epoxy system. It is suitable for bonding heat sensitive devices.
  • Low Viscosity
  • Excellent Penetration /Fast Flow
  • Halogen-free and complies with RoHS Directive 2015/863/EU

 

ALPHA HiTech offers a broad range of adhesives, underfills and edgebonding materials which provide significant mechanical reinforcement to soldered components and are compatible with other board level materials. 

Gluing, Underfilling and Edgebonding

ALPHA HiTech offers a broad range of adhesives, underfills and edgebonding materials which provide significant mechanical reinforcement to soldered components and are compatible with other board level materials. 

Gluing, Underfilling and Edgebonding

Many circuit board assemblers have found that low temperature solders offer substantial process, reliability and sustainability benefits by enabling lower peak reflow temperatures.

Low Temperature Solder Pastes Low Temperature Solid Solders

Many circuit board assemblers have found that low temperature solders offer substantial process, reliability and sustainability benefits by enabling lower peak reflow temperatures.

Low Temperature Solder Pastes Low Temperature Solid Solders

ALPHA HiTech offers a broad range of adhesives, underfills and edgebonding materials which provide significant mechanical reinforcement to soldered components and are compatible with other board level materials. 

Gluing, Underfilling and Edgebonding

ALPHA HiTech offers a broad range of adhesives, underfills and edgebonding materials which provide significant mechanical reinforcement to soldered components and are compatible with other board level materials. 

Gluing, Underfilling and Edgebonding

Many circuit board assemblers have found that low temperature solders offer substantial process, reliability and sustainability benefits by enabling lower peak reflow temperatures.

Low Temperature Solder Pastes Low Temperature Solid Solders

Many circuit board assemblers have found that low temperature solders offer substantial process, reliability and sustainability benefits by enabling lower peak reflow temperatures.

Low Temperature Solder Pastes Low Temperature Solid Solders
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