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Product Overview
ALPHA Argomax 2010C paste is a specifically designed sintering paste for high-volume, low-pressure sintering die attachment with a design that promotes consistent, uniform printing with long stencil life, even for large dies.
Product Features
- Applications: Die Attach, Die Top Attach
- Formulated for printing on Ag/Au surfaces
- Designed for die placement on dried paste
- Pure Silver bond line for high performance and reliability
- High thermal and electrical conductivity
- Low sintering pressure for high yield manufacturing
- Proven long stencil life
Proven reliability in EV drivetrain applications
ALPHA Argomax 2010C paste is a silver sintering die attach material specifically designed for die placement on dried paste followed by low-pressure sintering.
After sintering, it forms a high thermal and electrically conductive pure silver bond between the die and substrate. This high quality bond enables increased reliability (product life) and higher performance (higher power density).
Related Products
| PRODUCT TYPE | PRODUCT NAME | Compatible Surface Finish | Product Application Method | End Application |
|---|---|---|---|---|
| Sinter Paste | ALPHA Argomax 2040 Paste | Ag, Au | Print, Dot Dispense | Die Attach, Die Top Attach |
| Sinter Paste | ALPHA Argomax 5022 Paste | Cu | Die Attach, Die Top Attach | |
| Sinter Film | ALPHA Argomax 8020 Film | Ag, Au | Die Transfer Film | Die Attach, Die Top Attach, Spacer Attach |
| Engineered Sinter Product | ALPHA Argomax 6500 Bond Pad | Ag, Au, Cu | Pick & Place | Die Attach, Die Top Attach, Spacer Attach |
| Engineered Sinter Product | ALPHA Argomax 9200 Preform | Ag, Au | Pick & Place | Die Top Attach, Package/Module Attach, Substrate Attach, Spacer Attach |
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