Sintering Die Attach

Sinter die attach enables a number of critical advantages for high power switching applications, such as traction inverters.  It has been demonstrated that replacing solder with ALPHA Argomax sinter material extends power cycling endurance by factors of 15-30.  ALPHA Argomax can also enable +50% increase in switching current with the same die temperature rise by creating a highly efficient thermal path.

The transition to wide band gap devices also has presented a challenge for developers.  During power cycling, silicon dies will exhibit some flexure, which results in less total strain on the die attach material.  By comparison, SiC is very stiff, resulting in nearly all the strain from large rises in die temperature being directly placed on the die attach layer.

ALPHA Argomax is offered in both sinter paste and sinter film to support high volume die attach processes.   Our die attach file enables heated dies to be laminated with film, which then can be directly placed and sintered onto a DBC substrate or copper leadframe.

ALPHA Argomax paste is available for both stencil printing and flat dispense processes, supporting die attach.  The die is placed in the wet paste, eliminating the need for a tack agent. After drying, many modules or substrates can be sintered in parallel.

The significantly higher power cycling endurance demonstrated by ALPHA Argomax makes this material critical to enable the promise of higher current density and lower switching losses possible with SiC.