Search
Product Overview
ALPHA Accuflux Preforms for power electronics are an ideal solution for applications that require low voiding in large area solder joints and a low flux residue.
The flux application process for ALPHA Accuflux preforms is unique and guarantees each preform will have the same amount of flux within tightly controlled range. The low flux weight required to yield good solder wetting results in significantly reduced voiding levels.
Product Features
- Various larger area preform sizes and thicknesses available
- Fast placement using standard pick and place equipment
- Non-tack flux formulation compatible with vacuum pick up systems
- Available in standard alloys plus Innolot, Powerbond and high Pb alloys
- Can be combined with ALPHA TrueHeight bondline control preforms
- EIA-481 tape and reel packaging
Technical Bulletins
ALPHA Accuflux Flux Types and Applications for Power Electronics
Related Products
| PRODUCT TYPE | PRODUCT NAME | COMPATIBLE SURFACE FINISH | PRODUCT APPLICATION METHOD | END APPLICATION |
|---|---|---|---|---|
| Bond line Control Preforms | ALPHA TrueHeight Preforms | All solderable surfaces | Pick & Place | Clip Attach / Substrate Attach |
| Pb-free, High temp Alloy Preforms | ALPHA PowerBond Preforms | All solderable surfaces | Pick & Place | Substrate Attach / Other |
| Innolot Alloy Preforms | Innolot Preforms | All solderable surfaces | Pick & Place | Substrate Attach / Other |
What do you need solved?
Let our experts find your solution.
Let our experts find your solution.