ALPHA TrueHeight Preforms contain embedded bondline control wires that maintain a minimum bondline of the solder joint after reflow, ensuring solder joint reliability.

Multiple bondline control mechanisms can be included in a single solder preform to prevent tilt while ensuring a minimum bondline for applications such as warped substrate soldering.

These preforms are available in a wide range of sizes, suitable for clip attach, as well as substrate and heat spreader attach applications.

  • Bondline control for 75µm and larger thicknesses
  • Ideal solution for clip attach and warped substrates
  • Available in a wide variety of alloys, including PbSnAg, SnSb, SAC, Innolot, Powerbond, and others
  • ALPHA TrueHeight Preforms can be provided with an optional external ALPHA Accuflux flux coating.
  • Tape and reel packaging
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ALPHA TrueHeight Solder Preform Power image

TrueHeight Solder Preform Applications Die Attach / Clip Attach / Substrate Attach

Bond line control (BLC) preforms are used in die attach and die top clip attach to ensure uniform solder thickness for reliability.  

Bond line control mechanism is capable of addressing complex warped substrate applications by strategically locating the BLC wires within the solder preform in precise locations to ensure minimum bondline, and prevent tilt.  

Related Products

Product Type

Product Name

Compatible Surface Finish

Product Application Method

End Application

Flux Coated Preforms

Accuflux Preforms

All solderable surfaces

Pick & Place

Substrate Attach / Other

Innolot Alloy Preforms

Innolot Preforms

All solderable surfaces

Pick & Place

Substrate Attach / Other

Lead-free, high temp. Alloy Preforms

Powerbond Preforms

All solderable surfaces

Pick & Place

Substrate Attach / Other

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