Product Overview

ALPHA Powerbond Solder Preforms are a family of lead-free, high temperature, high reliability alloys with Antimony content ranging from 5-10%.  

The SnSb alloy system is an important addition to solder solutions addressing power electronics due to its increased strength and thermal fatigue resistance.  

ALPHA Powerbond 2050 is an SnSb5 based alloy and ALPHA Powerbond 2010 is an SnSb10 product, and offer improved wetting characteristics.  

These preforms are available in a wide range of sizes, and are offered in optional tape and reel packaging.   


 

Product Features

  • Excellent alternative in high lead alloy applications
  • Operating temperatures up to 175°C
  • High creep resistance & tensile strength
  • Improved wetting
  • Available with bondline control 
  • Available with ALPHA Accuflux flux coating
  • Tape and reel packaging & bulk options
Documentation icon - Technical Bulletin

ALPHA Powerbond Solder Preforms Technical Bulletin English

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PowerBond

ALPHA Powerbond Solder Preform Properties

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Bondline Control PreformsALPHA TrueHeight PreformsAll solderable surfacesPick & PlaceClip Attach / Substrate Attach
Flux Coated PreformsALPHA Accuflux PreformsAll solderable surfacesPick & PlaceSubstrate Attach / Other
Innolot Alloy PreformsInnolot PreformsAll solderable surfacesPick & PlaceSubstrate Attach / Other
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