Market leading solutions for Component/Passives attach
Advancement in semiconductor technology coupled with market growth for small form factor devices with multiple functionalities is driving heterogenous integration through SiP (System-in-Package). The ability to solder connect active and passives components on a SiP package is critical and one of the key material is solder paste. MacDermid Alpha provide a wide portfolio of solder paste to enable high density, fine pitch component attach.
![MAES-Solutions-Component](/sites/default/files/2021-09/SS_Solution-component1.jpg)