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High Thermal Conductivity Die Attach Film
ATROX CF200-1D high thermal and electrical conductivity film is designed for die attach assembly of semiconductor packages. The film offers excellent bond-ability to a variety of leadframe surfaces and die sizes with no resin bleed out (RBO). The bondline thickness is controlled accurately with no die tilting issues resulting in high yield assembly. The low outgassing property of the film ensures superior reliability and Moisture Sensitivity Level (MSL) performance.
Hybrid Silver Sintering Die Attach
The ATROX 800HT Series is a thermosetting conductive die attach adhesive with high thermal conductivity (>100 W/m-K) designed for high power semiconductors and exposed pad semiconductor packages. It has excellent adhesive strength to NiPdAu, Ag and MEP leadframes, low out gassing, which minimizes oven contamination, and is ideal for excellent MSL performance.
Sintered Die Attach
Advanced sinter and solder solutions addressing a wide variety of challenges for power electronics. Our engineered sinter materials are proven to enable high throughput and reliability while providing flexible and easy-to-use form factors that reduce the capital cost and accelerate time to market.
View Products in Die Attach
- ATROX HT900-1
The ATROX brand of conductive die attach pastes are designed to provide you with superior performance for today's stringent reliability requirements.
- Good thermal conductivity > 5 W/m-K
- Can be cured by thermal processing in standard IR, full convection, conduction or vapor phase oven equipment.
- Compatible with either nitrogen or air cure conditions.
- ATROX® 800HT7A
The ATROX brand of conductive die attach pastes are designed to provide you with superior performance for today's stringent reliability requirements.
- Ultra-low stress thermosetting conductive die attach adhesive.
- Very low shrinkage during cure.
- Low condensable organics which ensure excellent package reliability.
- ATROX® 800HT2V-P1
The ATROX brand of conductive die attach pastes are designed to provide you with superior performance for today's stringent reliability requirements.
- High thermal printable hybrid silver sintered die attach.
- High power semiconductor packages.
- Low resin bleed out.
- Low condensable organics.
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