Product Overview

STAYSTIK 591 thermoplastic adhesive film is designed for use in a variety of electronic applications, and is characterized by excellent bonding at low process temperatures. Its properties make it exceptional for heat sink and substrate attach as well as TAB bonding to PCB. The unique reworkability of this thermoplastic adhesive system offers many advantages in applications traditionally ill-suited to thermoset adhesives.

Features

  • Fast bonding to a variety of substrates
  • Easily reworkable material
Technical Data Sheet
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STAYSTIK 591 Adhesive Technical Data Sheet English

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STAYSTIK 591

Product Name

Adhesive Type

Adhesive Format

Adhesive Technology

Adhesive Application

Deposition Method

Silver

STAYSTIK 591

Conductive

Film Preforms

Electrically Conductive

Structural Bonding
Reworkable
Wafer Coating
Temporary Bonding

Lamination
Pressure Bonding
Pick & Place

Silver

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

STAYSTIK 191 STAYSTIK 571

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

STAYSTIK 191 STAYSTIK 571

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Aerospace Applications Optoelectronics Packaging Medical Devices Sensors

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Aerospace Applications Optoelectronics Packaging Medical Devices Sensors

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Structural Bonding Temporary Bonding Thermal Management

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Structural Bonding Temporary Bonding Thermal Management

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

STAYSTIK 191 STAYSTIK 571

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

STAYSTIK 191 STAYSTIK 571

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Aerospace Applications Optoelectronics Packaging Medical Devices Sensors

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Aerospace Applications Optoelectronics Packaging Medical Devices Sensors

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Structural Bonding Temporary Bonding Thermal Management

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Structural Bonding Temporary Bonding Thermal Management
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