Product Overview

The MICROFAB Pure BP process is engineered for copper pillar, copper stud and UBM applications. It provides exceptional within-die, within-feature uniformity, and high purity.

Features

  • High purity
  • Void free

For consultation with one of our experts and access to detailed technical data , please fill out and submit the contact us form.

High Purity and KV Free

MICROFAB Pure BP is MacDermid Alpha’s pure copper offering for copper pillar and delivers good co-planarity.

MICROFAB Pure BP

MICROFAB Pure BP

Product Name

Cu Packaging Solution

Cu Process Feature

Feature-Property Benefit

MICROFAB Pure BP

Pillar/Post

High Purity

High Purity – KV Free

Key Applications for MICROFAB Pure BP

MICROFAB Pure BP is MacDermid Alpha’s pure copper offering for copper pillar and delivers good co-planarity.

Wafer Level Packaging Heterogeneous Integration System in Package (SiP)

Key Applications for MICROFAB Pure BP

MICROFAB Pure BP is MacDermid Alpha’s pure copper offering for copper pillar and delivers good co-planarity.

Wafer Level Packaging Heterogeneous Integration System in Package (SiP)

Key Solutions for MICROFAB Pure BP

The MICROFAB Pure BP process is engineered for copper pillar, copper stud and UBM applications.

Wafer Bumping UBM Pillar / Post

Key Solutions for MICROFAB Pure BP

The MICROFAB Pure BP process is engineered for copper pillar, copper stud and UBM applications.

Wafer Bumping UBM Pillar / Post

Key Applications for MICROFAB Pure BP

MICROFAB Pure BP is MacDermid Alpha’s pure copper offering for copper pillar and delivers good co-planarity.

Wafer Level Packaging Heterogeneous Integration System in Package (SiP)

Key Applications for MICROFAB Pure BP

MICROFAB Pure BP is MacDermid Alpha’s pure copper offering for copper pillar and delivers good co-planarity.

Wafer Level Packaging Heterogeneous Integration System in Package (SiP)

Key Solutions for MICROFAB Pure BP

The MICROFAB Pure BP process is engineered for copper pillar, copper stud and UBM applications.

Wafer Bumping UBM Pillar / Post

Key Solutions for MICROFAB Pure BP

The MICROFAB Pure BP process is engineered for copper pillar, copper stud and UBM applications.

Wafer Bumping UBM Pillar / Post
What do you need solved?
Let our experts find your solution.
Contact Us