Product Overview

MICROFAB EVF NiBAR is a sulfamate nickel via fill and / or barrier electroplating process that produces a pure, ductile, fine-grained, low stress nickel deposit required to meet the needs of the semiconductor industry for quality assured chemistry. MICROFAB EVF NiBAR is manufactured to meet the exacting performance and manufacturing requirements associated with wafer plating and contains no boric acid in compliance with specific regulatory needs.

Features

  • High speed deposition
  • Bright/smooth
  • Small grain size
  • Stress tunable
  • Low temperature
     

For consultation with one of our experts and access to detailed technical data , please fill out and submit the contact us form.

Product Flyers
Documentation icon - Flyer

MICROFAB EVF NiBAR Flyer English

Download
Technical Data Sheet
TDS-icon

MICROFAB EVF NiBAR TDS English

Download
Plating Nickel -Macdermid Alpha

MICROFAB EVF NiBAR - Boric Acid Free Ni

Green initiatives are part of MacDermid Alpha’s product line roadmap. Keeping up with global regulatory concerns and needs has led to industry leading boric acid free electrolytic Ni for barrier and capable of Viafill, bump, UBM and RDL. MICROFAB EVF NiBAR is the next generation of Ni barrier technology that is stress and Viafill selectable.

  • Boric Acid Free – EHS and Regulatory Compliant
  • Viafill capable
  • Stress tunable
  • Low temperature

MICROFAB EVF NiBAR - Boric Acid Free Ni


 

Nickel plating- Macdermid AlphaBoric acid-free nickel plating

 

 

 

MICROFAB EVF NiBAR

Product Name

Nickel Function

Ni Process Feature

EHS Friendly

MICROFAB EVF NiBAR

Barrier Viafill

Bright - Smooth
High Speed
Small Grain size
Stress Tunable
Low Temperture
Excellent Coplanarity

Lead-Free
Boric Acid Alternative

Key Barrier Materials, Copper Pillar and Solder Bumps / Caps

  • Pillar/Post 
  • Viafill 
  • Barrier
MICROFAB SPM 1100 MICROFAB MP 2500 MICROFAB SC40 MICROFAB TS-650 MICROFAB SN-350 MICROFAB SN-300/302 MICROFAB AU660 MICROFAB NI-100 MICROFAB NI-200

Key Barrier Materials, Copper Pillar and Solder Bumps / Caps

  • Pillar/Post 
  • Viafill 
  • Barrier
MICROFAB SPM 1100 MICROFAB MP 2500 MICROFAB SC40 MICROFAB TS-650 MICROFAB SN-350 MICROFAB SN-300/302 MICROFAB AU660 MICROFAB NI-100 MICROFAB NI-200

Boric Acid Free Ni is EHS and Green Compliant

Part of MacDermid Alpha’s push for green initiatives MICROFAB EVF NiBar was created to match best in class performance of our historical POR MICROFAB NI200B. This solution is a direct barrier replacement that is viafill capable and stress adjustable.

Wafer Level Packaging System in Package (SiP) Power Semiconductor Sensors Heterogeneous Integration

Boric Acid Free Ni is EHS and Green Compliant

Part of MacDermid Alpha’s push for green initiatives MICROFAB EVF NiBar was created to match best in class performance of our historical POR MICROFAB NI200B. This solution is a direct barrier replacement that is viafill capable and stress adjustable.

Wafer Level Packaging System in Package (SiP) Power Semiconductor Sensors Heterogeneous Integration

Best in Class Barrier Performance

Part of MacDermid Alpha’s push for green initiatives MICROFAB EVF NiBar was created to match best in class performance of our historical POR MICROFAB NI200B. This solution is a direct barrier replacement that is viafill capable and stress adjustable.

UBM Thermal Management Wafer Bumping RDL

Best in Class Barrier Performance

Part of MacDermid Alpha’s push for green initiatives MICROFAB EVF NiBar was created to match best in class performance of our historical POR MICROFAB NI200B. This solution is a direct barrier replacement that is viafill capable and stress adjustable.

UBM Thermal Management Wafer Bumping RDL

Key Barrier Materials, Copper Pillar and Solder Bumps / Caps

  • Pillar/Post 
  • Viafill 
  • Barrier
MICROFAB SPM 1100 MICROFAB MP 2500 MICROFAB SC40 MICROFAB TS-650 MICROFAB SN-350 MICROFAB SN-300/302 MICROFAB AU660 MICROFAB NI-100 MICROFAB NI-200

Key Barrier Materials, Copper Pillar and Solder Bumps / Caps

  • Pillar/Post 
  • Viafill 
  • Barrier
MICROFAB SPM 1100 MICROFAB MP 2500 MICROFAB SC40 MICROFAB TS-650 MICROFAB SN-350 MICROFAB SN-300/302 MICROFAB AU660 MICROFAB NI-100 MICROFAB NI-200

Boric Acid Free Ni is EHS and Green Compliant

Part of MacDermid Alpha’s push for green initiatives MICROFAB EVF NiBar was created to match best in class performance of our historical POR MICROFAB NI200B. This solution is a direct barrier replacement that is viafill capable and stress adjustable.

Wafer Level Packaging System in Package (SiP) Power Semiconductor Sensors Heterogeneous Integration

Boric Acid Free Ni is EHS and Green Compliant

Part of MacDermid Alpha’s push for green initiatives MICROFAB EVF NiBar was created to match best in class performance of our historical POR MICROFAB NI200B. This solution is a direct barrier replacement that is viafill capable and stress adjustable.

Wafer Level Packaging System in Package (SiP) Power Semiconductor Sensors Heterogeneous Integration

Best in Class Barrier Performance

Part of MacDermid Alpha’s push for green initiatives MICROFAB EVF NiBar was created to match best in class performance of our historical POR MICROFAB NI200B. This solution is a direct barrier replacement that is viafill capable and stress adjustable.

UBM Thermal Management Wafer Bumping RDL

Best in Class Barrier Performance

Part of MacDermid Alpha’s push for green initiatives MICROFAB EVF NiBar was created to match best in class performance of our historical POR MICROFAB NI200B. This solution is a direct barrier replacement that is viafill capable and stress adjustable.

UBM Thermal Management Wafer Bumping RDL
What do you need solved?
Let our experts find your solution.
Contact Us