Product Overview

MICROFAB EVF NiBAR is a sulfamate nickel via fill and / or barrier electroplating process that produces a pure, ductile, fine-grained, low stress nickel deposit required to meet the needs of the semiconductor industry for quality assured chemistry. MICROFAB EVF NiBAR is manufactured to meet the exacting performance and manufacturing requirements associated with wafer plating and contains no boric acid in compliance with specific regulatory needs.

Features

  • High speed deposition
  • Bright/smooth
  • Small grain size
  • Stress tunable
  • Low temperature
     

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Product Flyers
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MICROFAB EVF NiBAR Flyer English

Technical Data Sheet
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MICROFAB EVF NiBAR TDS English

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Plating Nickel -Macdermid Alpha

MICROFAB EVF NiBAR - Boric Acid Free Ni

Green initiatives are part of MacDermid Alpha’s product line roadmap. Keeping up with global regulatory concerns and needs has led to industry leading boric acid free electrolytic Ni for barrier and capable of Viafill, bump, UBM and RDL. MICROFAB EVF NiBAR is the next generation of Ni barrier technology that is stress and Viafill selectable.

  • Boric Acid Free – EHS and Regulatory Compliant
  • Viafill capable
  • Stress tunable
  • Low temperature

MICROFAB EVF NiBAR - Boric Acid Free Ni


 

Nickel plating- Macdermid AlphaBoric acid-free nickel plating

 

 

 

MICROFAB EVF NiBAR

Product Name

Nickel Function

Ni Process Feature

EHS Friendly

MICROFAB EVF NiBAR

Barrier Viafill

Bright - Smooth
High Speed
Small Grain size
Stress Tunable
Low Temperture
Excellent Coplanarity

Lead-Free
Boric Acid Alternative

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