Product Overview

MICROFAB NI-100 is a nickel sulfamate electroplating process that produces a pure, ductile, fine-grained, matte, low stress nickel deposit required to meet the needs of the semiconductor industry for performance and manufacturing requirements associated with wafer plating.

Features

  • High speed deposition
  • Matte
  • Lead-free

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Nickel Sulfamate Electroplating Process

MICROFAB NI-100 is a nickel sulfamate electroplating process that produces a pure, ductile, fine-grained, matte, low stress nickel deposit required to meet the needs of the semiconductor industry.

Plating Nickel -Macdermid Alpha

MICROFAB NI-100

Product Name

Nickel Function

Ni Process Feature

EHS Friendly

MICROFAB NI-100

Barrier

Matte
High Speed

Lead-Free

Key Barrier Materials, Copper Pillar and Solder Bumps / Caps

  • Pillar/Post 
  • Viafill 
  • Barrier
MICROFAB SPM 1100 MICROFAB MP 2500 MICROFAB SC40 MICROFAB TS-650 MICROFAB SN-350 MICROFAB SN-300/302 MICROFAB AU660 MICROFAB NI-200 MICROFAB EVF NiBAR

Key Barrier Materials, Copper Pillar and Solder Bumps / Caps

  • Pillar/Post 
  • Viafill 
  • Barrier
MICROFAB SPM 1100 MICROFAB MP 2500 MICROFAB SC40 MICROFAB TS-650 MICROFAB SN-350 MICROFAB SN-300/302 MICROFAB AU660 MICROFAB NI-200 MICROFAB EVF NiBAR

MICROFAB NI100B – Matte Barrier

Part of MacDermid Alpha’s historic POR barrier technology and tool OEM BKM.

Wafer Level Packaging System in Package (SiP) Power Semiconductor Sensors Heterogeneous Integration

MICROFAB NI100B – Matte Barrier

Part of MacDermid Alpha’s historic POR barrier technology and tool OEM BKM.

Wafer Level Packaging System in Package (SiP) Power Semiconductor Sensors Heterogeneous Integration

Best in Class Barrier Performance

MICROFAB NI-100 is a Ni Barrier to ensure KV free and stable intermetallic between the copper pillar and solder cap or C4.

UBM Thermal Management Wafer Bumping Pillar / Post

Best in Class Barrier Performance

MICROFAB NI-100 is a Ni Barrier to ensure KV free and stable intermetallic between the copper pillar and solder cap or C4.

UBM Thermal Management Wafer Bumping Pillar / Post

Key Barrier Materials, Copper Pillar and Solder Bumps / Caps

  • Pillar/Post 
  • Viafill 
  • Barrier
MICROFAB SPM 1100 MICROFAB MP 2500 MICROFAB SC40 MICROFAB TS-650 MICROFAB SN-350 MICROFAB SN-300/302 MICROFAB AU660 MICROFAB NI-200 MICROFAB EVF NiBAR

Key Barrier Materials, Copper Pillar and Solder Bumps / Caps

  • Pillar/Post 
  • Viafill 
  • Barrier
MICROFAB SPM 1100 MICROFAB MP 2500 MICROFAB SC40 MICROFAB TS-650 MICROFAB SN-350 MICROFAB SN-300/302 MICROFAB AU660 MICROFAB NI-200 MICROFAB EVF NiBAR

MICROFAB NI100B – Matte Barrier

Part of MacDermid Alpha’s historic POR barrier technology and tool OEM BKM.

Wafer Level Packaging System in Package (SiP) Power Semiconductor Sensors Heterogeneous Integration

MICROFAB NI100B – Matte Barrier

Part of MacDermid Alpha’s historic POR barrier technology and tool OEM BKM.

Wafer Level Packaging System in Package (SiP) Power Semiconductor Sensors Heterogeneous Integration

Best in Class Barrier Performance

MICROFAB NI-100 is a Ni Barrier to ensure KV free and stable intermetallic between the copper pillar and solder cap or C4.

UBM Thermal Management Wafer Bumping Pillar / Post

Best in Class Barrier Performance

MICROFAB NI-100 is a Ni Barrier to ensure KV free and stable intermetallic between the copper pillar and solder cap or C4.

UBM Thermal Management Wafer Bumping Pillar / Post
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