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Product Overview
MICROFAB SC-40 PLUS demonstrates high-speed plating capabilities of up to 2.5 µm/min. The process delivers a high purity deposit with exceptional within-wafer, within-die and within-feature uniformity and a flat bump profile. The versatile chemistry of MICROFAB SC-40 PLUS is suitable for bump, pillar and RDL metallization and is compatible with and without a nickel barrier process for Kirkendall void free stacks.
- High-speed plating up to 2.5 µm/min
- High purity deposits with cutting-edge uniformity
- Flat bump profile
- KV free
- Versatile
- Ease of use
Innovative copper pillar plating for next-generation packaging solutions
MICROFAB SC-40 PLUS is part of the next generation of MacDermid Alpha’s SC products, a range of products and processes with over 10 years in the market. MICROFAB SC-40 PLUS represents a leap forward in semiconductor manufacturing, providing fabricators with a transformative solution that combines precision, efficiency, and ease of use.
Reliability Excellence
MICROFAB SC-40 PLUS is a highly pure system to eliminate interfacial voids, suitable for a range of applications including pillar, UBM and L/S RDL. Through the harsh JEDEC reliability test, the copper/solder interface exhibits no voids. The excellent reliability of MICROFAB SC-40 PLUS is retained even when the bath is aged.
MICROFAB SC-40 PLUS
| PRODUCT NAME | CU PACKAGING SOLUTION | CU PROCESS FEATURE | FEATURE - PROPERTY BENEFIT |
|---|---|---|---|
| MICROFAB SC-40 PLUS | Pillar UBM RDL | High speed High purity deposit Cutting-edge uniformity | Versatile Flat Bump Void Free |
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