Product Overview

The MICROFAB SPM-1200 process is engineered for copper pillar, copper stud and UBM applications. MICROFAB SPM-1200 copper plating solution demonstrates flat feature shape and high purity plated films producing very low KV risk.

Features

  • Good WID, WIF
  • Excellent coplanarity
  • High throughput
  • Flat bump shape
  • Low voiding

For consultation with one of our experts and access to detailed technical data, please fill out and submit thecontact us form.

MICROFAB SPM-1200

Product Name

Cu Packaging Solution

Cu Process Feature

Feature-Property Benefit

MICROFAB SPM-1200

Pillar/Post

Good WID, WIF

Flat Bump Shape
Low KV

Key Barrier Materials and Solders to Produce High Reliability Interconnects

  • Pillar/Post, RDL
MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB TS-650 MICROFAB SN-350 MICROFAB SN-300/302

Key Barrier Materials and Solders to Produce High Reliability Interconnects

  • Pillar/Post, RDL
MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB TS-650 MICROFAB SN-350 MICROFAB SN-300/302

Highly Co-Planar Copper Pillar

Perfectly matched with Sn/Ag and pure Sn product offerings with and without a nickel barrier for KV free and low KV performance.

Wafer Level Packaging System in Package (SiP) Heterogeneous Integration

Highly Co-Planar Copper Pillar

Perfectly matched with Sn/Ag and pure Sn product offerings with and without a nickel barrier for KV free and low KV performance.

Wafer Level Packaging System in Package (SiP) Heterogeneous Integration

MICROFAB SPM-1200 is the Latest High-Speed Pillar Offering

MICROFAB SPM-1200 is an excellent choice for high purity, high speed plating with best in class coplanarity.

UBM Wafer Bumping Pillar / Post

MICROFAB SPM-1200 is the Latest High-Speed Pillar Offering

MICROFAB SPM-1200 is an excellent choice for high purity, high speed plating with best in class coplanarity.

UBM Wafer Bumping Pillar / Post

Key Barrier Materials and Solders to Produce High Reliability Interconnects

  • Pillar/Post, RDL
MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB TS-650 MICROFAB SN-350 MICROFAB SN-300/302

Key Barrier Materials and Solders to Produce High Reliability Interconnects

  • Pillar/Post, RDL
MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB TS-650 MICROFAB SN-350 MICROFAB SN-300/302

Highly Co-Planar Copper Pillar

Perfectly matched with Sn/Ag and pure Sn product offerings with and without a nickel barrier for KV free and low KV performance.

Wafer Level Packaging System in Package (SiP) Heterogeneous Integration

Highly Co-Planar Copper Pillar

Perfectly matched with Sn/Ag and pure Sn product offerings with and without a nickel barrier for KV free and low KV performance.

Wafer Level Packaging System in Package (SiP) Heterogeneous Integration

MICROFAB SPM-1200 is the Latest High-Speed Pillar Offering

MICROFAB SPM-1200 is an excellent choice for high purity, high speed plating with best in class coplanarity.

UBM Wafer Bumping Pillar / Post

MICROFAB SPM-1200 is the Latest High-Speed Pillar Offering

MICROFAB SPM-1200 is an excellent choice for high purity, high speed plating with best in class coplanarity.

UBM Wafer Bumping Pillar / Post
What do you need solved?
Let our experts find your solution.
Contact Us