Product Overview

The NOVAFAB HPM-500 is a high-performance copper process engineered for pillar applications. It provides exceptional within-die (WID), and within-feature uniformity (WIF, TIR).

Features

  • Best-in-class coplanarity
  • High purity

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Next Generation of Highly Co-Planar Copper Pillar Plating Solutions

NOVAFAB HPM-500 is the next generation of highly co-planar copper pillar plating solutions. It is also perfectly mated with our Boric Acid free Ni barrier and Tin Silver solutions (MICROFAB EVF NiBar) & (MICROFAB TS-650)

  • Flat Bump Shape
  • Excellent Coplanarity
     
NOVAFAB-HPM-500

NOVAFAB HPM-500

Product Name

Cu Packaging Solution

Cu Process Feature

Feature-Property Benefit

MICROFAB HPM-500

Pillar/Post, RDL

Best-In-class Coplanarity
High Purity

High Purity – KV Low

Superior Coplanarity Copper Pillar

Perfectly matched with Sn/Ag and pure Sn product offerings with and without a nickel barrier for KV free and low KV performance.

Wafer Level Packaging System in Package (SiP) Heterogeneous Integration

Superior Coplanarity Copper Pillar

Perfectly matched with Sn/Ag and pure Sn product offerings with and without a nickel barrier for KV free and low KV performance.

Wafer Level Packaging System in Package (SiP) Heterogeneous Integration

Flat Pillars with Superior Coplanarity

NOVAFAB HPM-500 is an excellent choice for high purity copper pillars with best in class coplanarity.

Wafer Bumping Pillar / Post

Flat Pillars with Superior Coplanarity

NOVAFAB HPM-500 is an excellent choice for high purity copper pillars with best in class coplanarity.

Wafer Bumping Pillar / Post

Superior Coplanarity Copper Pillar

Perfectly matched with Sn/Ag and pure Sn product offerings with and without a nickel barrier for KV free and low KV performance.

Wafer Level Packaging System in Package (SiP) Heterogeneous Integration

Superior Coplanarity Copper Pillar

Perfectly matched with Sn/Ag and pure Sn product offerings with and without a nickel barrier for KV free and low KV performance.

Wafer Level Packaging System in Package (SiP) Heterogeneous Integration

Flat Pillars with Superior Coplanarity

NOVAFAB HPM-500 is an excellent choice for high purity copper pillars with best in class coplanarity.

Wafer Bumping Pillar / Post

Flat Pillars with Superior Coplanarity

NOVAFAB HPM-500 is an excellent choice for high purity copper pillars with best in class coplanarity.

Wafer Bumping Pillar / Post
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