Technical Bulletins

A high-solid, rosin-bearing, no-clean, alcohol-based flux.  It has excellent solderability in tin-lead wave soldering processes.

A fully synthetic (no rosin or rosin derivatives) flux cored wire designed to be a direct replacement for traditional rosin-cored wire solders.

A rosin-based paste flux designed for rework of surface mount and other demanding electronic assembly applications.

A one component, high filler content, heat curable Edgebond designed to be dispensed on the corners (corner bonding) or edges (edge bonding) of BGA devices.

ALPHA HiTech AD13-9521B is a one component low temperature cure epoxy system. It is suitable for bonding heat-sensitive devices. 

ALPHA HiTech AD13-9620B is engineered for use in the camera module application. It exhibits excellent adhesion strength for bonding between LCP to Magnet surfaces.

ALPHA HiTech AD13-9692B is a one-component, low temperature cure epoxy system.  It is suitable for bonding heat sensitive devices and is specially designed for camera module application.

A one-component, ultra-low temperature cure epoxy system that enables excellent adhesion strength with a reduction in the defect rate on very low temperature sensitive parts and substrates.

ALPHA HiTech AD13-9910B 是一种单组分、超低温固化环氧树脂系統。 该产品可低至 60 °C 的温度下固化，具备优异的粘结强度，并可降低对温度非常敏感的零件和基板的缺陷率。

Has excellent adhesion performance even after temperature and thermal shock exposure, fast curing performance at low temperatures to provide high throughput manufacturing process, and exhibits high tensile strength during high temperature testing. 

一种单组分、高填料含量、可热固化的边缘粘结剂。 它是一种基于环氧树脂的材料，可点涂到BGA器件的角部（拐角粘合）或边缘（边缘粘合）。