Technical Bulletins

A product with high filler content, is available to provide better mechanical strength for CSP and Flip Chip packages.  Has a unique low viscosity property, making it possible to secure full coverage flow at room temperature without preheat.  For a faster flow rate, preheat of < 80°C is recommended on substrates during dispensing process.

是一种单组分毛细底部填充剂，用于保护印刷电路板上的芯片封装。 它可以保护焊点對抗机械应力，如跌落冲击和冲击弯曲。建议基板上采用不超过80°C的更高预热温度，可能实现更快填充流量。

A one-component, low temp thermal cure capillary underfill designed for low temperature applications requiring enhanced mechanical strength for chip packages assembled on printed circuit boards.  An excellent option for processes requiring curing temperature as low as 80°C.

A one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. It is a high Tg and low CTE underfill with excellent reliability.

是一款单组分毛细底部填充剂，用于保护印刷电路板上的芯片封装，且拥有较高的玻璃化温度(Tg)和低热膨胀系数(CTE)的高可靠性底部填充材料

 A one-component capillary underfill designed for the protection of assembled chip packages on printed circuit boards.

是一种单组分毛细底部填充剂，用于保护印刷电路板上的芯片封装。

Has a high hardness property which makes it very suitable for assembly of components requiring excellent reinforcement strength. ALPHA HiTech EN21-4210 Series is a non-reworkable encapsulant product option.

A one-component epoxy system designed to improve the attachment strength of solder joints by encapsulating the material over the chip component. 

An adhesive that is applicable to both screen printing and dispensing applications.  This is the primary product recommended to customers requiring a screen printable adhesive.

一种适用于网印和点胶应用的粘合剂，这是向需要网印粘合剂的客户推荐的主打产品。

Ideal for high-speed dispensing processes given its non-sagging property.  Has been tested to provide excellent adhesion after curing. This product can also be printed.