Technical Bulletins

鉴于其不凹陷特性，非常适合高速点胶工艺。经测试可在固化后具备优异的黏附力。本产品也可以进行印刷。

Used for curing processes requiring instant curing process.  With sufficient exposure to UV it can provide excellent adhesion strength  within seconds, a high throughput manufacturing process.  

Designed to enable low temperature processes in selective and dip soldering.

ALPHA HT-130DHF-3 Adhesives Technical Bulletin

A non-flammable, water-based inorganic formulation for dip or wave applications.

A lead-free alloy designed for high temperature, high reliability applications.

The recommended thinner for several Alpha fluxes.

A lead-free, no-clean solder paste designed for Jet Printing and features a rheology capable of standard dispensing or high through put jetting.

一款特别为喷射印刷应用而开发的无铅免清洗锡膏。

A lead-free, no-clean solder paste designed for Jet Printing and features a rheology capable of standard dispensing or jetting.