Technical Bulletins

ALPHA OM-565 HRL3 low temperature solder paste is formulated for a broad range of assemblies to mitigate warpage induced defects in temperature sensitive chip-scale packages.

一款无铅，免清洗锡膏。

A lead-free, no-clean solder paste designed for a broad range of applications, designed to minimize transition concerns from tin/lead to lead free solder paste, and is engineered to deliver the comparable performance to a tin lead process.