Technical Bulletins

一款免清洗锡膏，在各种应用条件下都能实现最佳性能。

No-clean, BGA Flux.

A tin-lead, no clean solder paste developed for mixed alloy assemblies to meet the demands of tin lead soldering when lead-free components are present in the circuit assembly. 

是为了满足电路组装中存在无铅元件时的锡铅焊接需求而设。

A low temperature chemistry supporting non-eutectic low temperature alloys reflow or rework in a low temperature process. When used with Alpha’s HRL1 solder alloy, assemblies exhibit similar drop shock and thermal cycling performance to SAC305 joints.