Technical Bulletins

Package on package BGA Flux.

No-clean, zero-halogen paste flux for package on package assembly.

An inorganic acid type solder paste that is water-soluble before and after reflow.  This paste is specifically formulated for pressure dispensing applications and is excellent for printing applications with high temperature alloys.

Designed for High Temperature, High Reliability, Lead-Free Applications

A zero-halogen and halide-free organic based liquid flux designed specifically for Multi-busbar PV assembly and formulated to overcome the smaller surface area of wire used in multi-busbar applications and deliver excellent peel force that result in long term stability of the solder joints.