Technical Bulletins

Special Spray, Foam and Wave Flux (Type 1.1.3 Flux in Accordance with EN ISO 9454-2:2000)

A rosin-based halide-free, ROL0 paste flux designed for a broad range of applications and alloys. An ideal paste flux for reworking tin/lead or lead-free BGA components.  

A rosin-based halide-free, ROL0 paste flux designed for a broad range of applications and alloys. An ideal paste flux for reworking tin/lead or lead-free BGA components.  

Rosin Based paste flux

A rosin based flux gel designed for surface mount processes and other demanding electronics assembly applications, including rework, where post reflow cleaning is not required.

A solder paste designed for stencil printing in surface mount process.  Has an outstanding activation system which reduces the occurrence of solder ball and improves wettability on OSP (Halide content: 800ppm).

Rosin Based ROL1 Paste Flux